HARDWARE

Creating a new generation of smart lighting

KEY FEATURES

Auto - Mesh Sensing System

Connectivity & Network
Wireless Mesh Networking – No cabling required

Stable, Scalable Network – Supports over 60,000 nodes

Single Gateway Efficiency – One gateway manages 1,000+ lights




Installation & Configuration
Plug-and-Play Setup – Ready for use upon installation

Zone Grouping & Cloud Integration – Self-learning, self-organizing, configuration-free





Energy Efficiency & Smart Sensing
Intelligent Sensing – Imperceptible savings, over 80% energy efficiency

Infrared Presence Detection – Resilient even in extreme environments

Patented End Caps – Detect people and vehicles with high sensitivity



Lighting Performance & Longevity
High Luminous Efficacy – Powerful, consistent illumination

Extended Lifespan – Only 5% light decay in 5 years, up to 10-year service life
Materials & Safety
Jade Composite Housing – Electrically safe, flame-retardant, excellent heat dissipation

Superior Durability – Maintains clarity and integrity without yellowing or brittleness

QUALITY CONTROL SOLUTIONS

We provide advanced packaging technologies and integrated services spanning research and development, production, sales, and final testing. Designed specifically for scale, reliability, and speed.

3D PACKAGING

Greater density, superior performance and more efficient integration.

Greater density, superior performance and more efficient integration.

WAFER-LEVEL PACKAGING

Ultra-compact form factor, exceptional performance.

Ultra-compact form factor, exceptional performance.

SYSTEM-LEVEL PACKAGING

High-density integration, without compromising on performance or footprint.

High-density integration, without compromising on performance or footprint.

WIRE-AND-REEL PACKAGING

Reliable and cost-effective interconnections for mass production.

Reliable and cost-effective interconnections for mass production.

FLIP CHIP PACKAGING

High-density, high-performance interconnects for advanced miniaturisation.

High-density, high-performance interconnects for advanced miniaturisation.

WAFER BUMP

Foundational process technologies for high-yield advanced packaging.

Foundational process technologies for high-yield advanced packaging.

THE IOT STRUCTURE

A fully automated management system that’s smart, simple, and energy-efficient—delivering comfort for users while cutting operational costs

- Manage multiple devices & sensors
- Accurate data delivery & energy analysis
- Flexible through APP or Web
- Supports HTTP & MQTT protocols

Operating Principles

Devices – Gateway – Applications